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M. Bründel
M. Bründel
Bosch
Materials science
Electronic engineering
Wafer-level packaging
Die (integrated circuit)
Laser bonding
5
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48
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Very poor prognosis after a conservatively treated hip fracture in the most frail nursing home residents
2021
M.M.T.J. Broekman
J. de Vos
L. de Vijlder
M. Bründel
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Wafer-level packaging and laser bonding as an approach for silicon-into-lab-on-chip integration
2013
Journal of Micromechanics and Microengineering
Thomas Brettschneider
Christian Dorrer
M. Bründel
Roland Zengerle
Martina Daub
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Citations (8)
Integration of CMOS Biosensor into a Polymeric Lab-on-a-Chip System
2013
World Academy of Science, Engineering and Technology, International Journal of Electrical, Computer, Energetic, Electronic and Communication Engineering
Thomas Brettschneider
Christian Dorrer
H. Suy
T. Braun
E. Jung
R. Hoofman
M. Bründel
Roland Zengerle
Franz Lärmer
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Citations (1)
Through mold via technology for multi-sensor stacking
2012
EPTC | Electronics Packaging Technology Conference
T. Braun
M. Bründel
K.-F. Becker
R. Kahle
K. Piefke
U. Scholz
Frieder Haag
V. Bader
S. Voges
T. Thomas
R. Aschenbrenner
K.-D. Lang
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Citations (15)
Large area embedding for heterogeneous system integration
2010
ECTC | Electronic Components and Technology Conference
T. Braun
K.-F. Becker
Lars Böttcher
J. Bauer
T. Thomas
M. Koch
R. Kahle
A. Ostmann
R. Aschenbrenner
H. Reichl
M. Bründel
J. F. Haag
U. Scholz
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Citations (24)
1