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K. Piefke
K. Piefke
Fraunhofer Society
Quad Flat No-leads package
Printed circuit board
Materials science
Electronic engineering
System in package
3
Papers
60
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Through mold via technology for multi-sensor stacking
2012
EPTC | Electronics Packaging Technology Conference
T. Braun
M. Bründel
K.-F. Becker
R. Kahle
K. Piefke
U. Scholz
Frieder Haag
V. Bader
S. Voges
T. Thomas
R. Aschenbrenner
K.-D. Lang
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Citations (15)
Through mold vias for stacking of mold embedded packages
2011
ECTC | Electronic Components and Technology Conference
T. Braun
K.-F. Becker
S. Voges
T. Thomas
R. Kahle
V. Bader
J. Bauer
K. Piefke
R. Krüger
R. Aschenbrenner
Klaus-Dieter Lang
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Citations (31)
Through mold vias for stacking of mold embedded packages
2011
Electronic Components and Technology Conference
Thomas R. Braun
K.-F. Becker
S. Voges
Thomas P. Thomas
Reinhard Kahle
Veit Michael Bader
Jörg Bauer
K. Piefke
Russell Kruger
R. Aschenbrenner
Kenneth Lang
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Citations (14)
1