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Hugues Gagnon
Hugues Gagnon
IBM
Electronic engineering
Materials science
CMOS
Chip
Strain energy release rate
2
Papers
7
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0
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Chip-Package Interaction Challenges for Large Die Applications
2018
ECTC | Electronic Components and Technology Conference
Zhuo-Jie Wu
Charles Carey
Samantha Donavan
Doug Hunt
Patrick Justison
Theo Anemikos
John Cincotta
Hugues Gagnon
Oswaldo Chacon
Robert Martel
Thomas A. Wassick
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Chip package interaction evaluation for a high performance 65nm and 45nm CMOS Technology in a stacked die package with C4 and wirebond interconnections
2008
ECTC | Electronic Components and Technology Conference
Christopher D. Muzzy
David Danovitch
Hugues Gagnon
Robert Hannon
Emily R. Kinser
Paul V. McLaughlin
Guy Mongeau
Jean-Guy Quintal
Jocelyn Sylvestre
Eric Turcotte
J. Wright
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Citations (6)
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