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Zhuo-Jie Wu
Zhuo-Jie Wu
Electronic engineering
Strain energy release rate
Wafer dicing
Materials science
Thermal copper pillar bump
2
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3
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Chip-Package Interaction Challenges for Large Die Applications
2018
ECTC | Electronic Components and Technology Conference
Zhuo-Jie Wu
Charles Carey
Samantha Donavan
Doug Hunt
Patrick Justison
Theo Anemikos
John Cincotta
Hugues Gagnon
Oswaldo Chacon
Robert Martel
Thomas A. Wassick
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Die Edge Crack Propagation Modeling for Risk Assessment of Advanced Technology Nodes
2018
ECTC | Electronic Components and Technology Conference
Tingge Xu
Zhuo-Jie Wu
Haojun Zhang
Carole Graas
Patrick Justison
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Citations (2)
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