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Oswaldo Chacon
Oswaldo Chacon
Materials science
Ball grid array
Electronic engineering
Strain energy release rate
Wafer dicing
2
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Chip-Package Interaction Challenges for Large Die Applications
2018
ECTC | Electronic Components and Technology Conference
Zhuo-Jie Wu
Charles Carey
Samantha Donavan
Doug Hunt
Patrick Justison
Theo Anemikos
John Cincotta
Hugues Gagnon
Oswaldo Chacon
Robert Martel
Thomas A. Wassick
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Pb-free PBGA Design Points to Improve Handling Robustness
2012
Isabel de Sousa
Brian Roggeman
Oswaldo Chacon
Niki Spencer
Mamoru Ueno
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