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Cheng-Ta Ko
Cheng-Ta Ko
Composite material
Materials science
Chip-scale package
Dielectric
Substrate (chemistry)
1
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10
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Chip-in-substrate package, CiSP, technology
2004
EPTC | Electronics Packaging Technology Conference
Yu-Hua Chen
Jyh-Rong Lin
Shou-Lung Chen
Cheng-Ta Ko
Tzu-Ying Kuo
Chien-Wei Chien
Shan-Pu Yu
A. Ostmann
A Neumann
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Citations (10)
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