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Shan-Pu Yu
Shan-Pu Yu
Materials science
Chip-scale package
Electronic engineering
Chip
Composite material
3
Papers
42
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The evaluation of wafer thinning and singulating processes to enhance chip strength
2005
ECTC | Electronic Components and Technology Conference
Shou-Lung Chen
Tzu-Ying Kuo
Hsu-Tien Hu
Jyh-Rong Lin
Shan-Pu Yu
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Citations (27)
Chip-in-substrate package, CiSP, technology
2004
EPTC | Electronics Packaging Technology Conference
Yu-Hua Chen
Jyh-Rong Lin
Shou-Lung Chen
Cheng-Ta Ko
Tzu-Ying Kuo
Chien-Wei Chien
Shan-Pu Yu
A. Ostmann
A Neumann
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Board-level reliability of lead-free SnAgCu solder joint
2002
Jian-Shu Wu
Shan-Pu Yu
I-Hsuan Peng
Jong-Lih Wang
B. Chung
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Citations (5)
1