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Shou-Lung Chen
Shou-Lung Chen
Materials science
Chip
Electronic engineering
Packaging engineering
Lamination
4
Papers
72
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High-Speed and High-Power 940 nm Flip-Chip VCSEL Array for LiDAR Application
2021
Kuo-Bin Hong
Wei-Ta Huang
Hsin-Chan Chung
Guan-Hao Chang
Dong Yang
Zhi-Kuang Lu
Shou-Lung Chen
Hao-Chung Kuo
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Embedded active device packaging technology for next-generation chip-in-substrate package, CiSP
2006
ECTC | Electronic Components and Technology Conference
Cheng-Ta Ko
Shou-Lung Chen
Chia-Wen Chiang
Tzu-Ying Kuo
Ying-Ching Shih
Yu-Hua Chen
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Citations (35)
The evaluation of wafer thinning and singulating processes to enhance chip strength
2005
ECTC | Electronic Components and Technology Conference
Shou-Lung Chen
Tzu-Ying Kuo
Hsu-Tien Hu
Jyh-Rong Lin
Shan-Pu Yu
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Citations (27)
Chip-in-substrate package, CiSP, technology
2004
EPTC | Electronics Packaging Technology Conference
Yu-Hua Chen
Jyh-Rong Lin
Shou-Lung Chen
Cheng-Ta Ko
Tzu-Ying Kuo
Chien-Wei Chien
Shan-Pu Yu
A. Ostmann
A Neumann
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Citations (10)
1