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Laurent Vandroux

6

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22

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Method for obtaining at least one nanoelement has silicon in a wafer of silicon oxide, manufacturing process of a device implementing the method for obtaining

2012
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Method of direct bonding between two plates, comprising a step of forming a temporary protective layer has a nitrogen base

2010
- Cioccio Lea Di
- Laurent Vandroux
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An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling

2009
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Multi levels Air gap Integration using Sacrificial Material Approach for Advanced Cu Interconnects Technologies

2008
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units manufacturing process within a layer of polymer

2007
- Frederic-Xavier Gaillard
- Laurent Vandroux
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