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Jay Vang
Jay Vang
System in package
Mechanical engineering
Void (astronomy)
Materials science
1
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4
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Warpage and Void Simulation of System in Package
2020
ECTC | Electronic Components and Technology Conference
Eric Ouyang
YongHyuk Jeong
JaeMyong Kim
S.P. Lin
Jay Vang
Anthony D. Yang
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Citations (4)
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