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Daniel Araújo Barros
Daniel Araújo Barros
University of Minho
Creep
Metallurgy
Materials science
Microstructure
Tin-silver-copper
2
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2
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Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder
2018
Pedro E. A. Ribeiro
Delfim Soares
Maria Fátima Cerqueira
S. F. C. F. Teixeira
Daniel Araújo Barros
José Carlos Teixeira
Pauline Capela
F. Macedo
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Creep behavior of a solder paste with BI addition
2017
Pedro E. A. Ribeiro
Delfim Soares
M. F. Cerqueira
S. F. C. F. Teixeira
Daniel Araújo Barros
J. Carlos Teixeira
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Citations (2)
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