Creep behavior of a solder paste with BI addition

The authors would like to express his acknowledgments for the support given by the Portugal Incentive System for Research and Technological Development. Project in co-promotion ner 002814/2015 (iFACTORY 2015-2018). This work is supported by FCT with the reference project UID/EEA/04436/2013, by FEDER funds through the COMPETE 2020 – Programa Operacional Competitividade e Internacionalizacao (POCI) with the reference project POCI-01-0145-FEDER-006941. This work was financed by FCT, under the Strategic Project UID/SEM/04077/2013; PEst2015-2020 with the reference UID/CEC/00319/2013 and UID/FIS/04650/2013.