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Pauline Capela
Pauline Capela
University of Minho
Creep
Tin-silver-copper
Soldering
Metallurgy
Materials science
2
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Influence of the Applied Load on the Creep Behaviour of Tin-Silver-Copper Solder
2019
Delfim Soares
Pedro E. Ribeiro
Pauline Capela
Daniel A. Barros
Maria F. Cerqueira
Senhorinha F. C. F. Teixeira
F. Macedo
José A. Teixeira
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Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder
2018
Pedro E. A. Ribeiro
Delfim Soares
Maria Fátima Cerqueira
S. F. C. F. Teixeira
Daniel Araújo Barros
José Carlos Teixeira
Pauline Capela
F. Macedo
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