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Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder
Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder
2018
Pedro E. A. Ribeiro
Delfim Soares
Maria Fátima Cerqueira
S. F. C. F. Teixeira
Daniel Araújo Barros
José Carlos Teixeira
Pauline Capela
F. Macedo
Keywords:
Microstructure
Creep
Tin-silver-copper
Soldering
Metallurgy
Materials science
Copper
Correction
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