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Properties and reliability of liquid epoxy resin for LSI fabrication with the printing encapsulation system (PES)
Properties and reliability of liquid epoxy resin for LSI fabrication with the printing encapsulation system (PES)
1997
Atsushi Okuno
Noriko Fujita
Koichiro Nagai
Noritaka Oyama
Tsunekazu Hashimoto
Keywords:
Computer science
Engineering drawing
Epoxy
Nanotechnology
Electronic engineering
Encapsulation (computer programming)
Transfer molding
Fabrication
Correction
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