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Jason Li

Applied Materials

3

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Ultrathin integrated ion metal plasma titanium and metallorganic titanium nitride liners for sub 0.18 μm W based metallization schemes for >500 MHz microprocessors

1999
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Integrated IMP Ti and MOCVD TiN for 300-mm W barrier and liner for sub-0.18-μm IC processing

1999
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Integrated arc suppression unit for defect reduction in PVD applications

1997
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