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Diana Ma
Diana Ma
Metallurgy
Etching
Materials science
Aluminium
Copper
4
Papers
6
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2024
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Development of copper etch technology for advanced copper interconnects
1999
ASMC | Advanced Semiconductor Manufacturing Conference
P. Koch
Yan Ye
Diana Ma
Allen Zhao
Peter Hsieh
Chun-mu
Jenn Chow
S Sherman
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Citations (4)
Etch/metallization process sequence integration-impact of Al texture on Al etch performance
1998
IITC | International Interconnect Technology Conference
Chun Yan
Jeffrey Stokes
Sue Arias
Yan Ye
Diana Ma
Liang Chen
Suchitra Subrahmanyan
Hong Zhang
Sue McArthur
Nitin Khurana
Rod Mosely
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Development of Cu etch process for advanced Cu interconnects
1998
IITC | International Interconnect Technology Conference
Yan Ye
Diana Ma
Allen Zhao
Peter Hsieh
Wayne Tu
Xiancan Deng
Gary Chu
Chun-mu
Jenn Chow
Peter K. Moon
Steta Sherman
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Procede de gravure a haute temperature de couches a motifs a l'aide d'un empilement de couches organiques de masquage
1998
Yan Ye
Allen Zhao
Peter Hsieh
Diana Ma
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