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Jay Bartelo
Jay Bartelo
IBM
Composite material
Eutectic system
Metallurgy
Soldering
Materials science
3
Papers
249
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Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
2004
ECTC | Electronic Components and Technology Conference
Sung K. Kang
Paul A. Lauro
Da-Yuan Shih
Donald W. Henderson
Timothy A. Gosselin
Jay Bartelo
Steve R. Cain
Charles Goldsmith
Karl J. Puttlitz
Tae-Kyung Hwang
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Citations (42)
The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints
2004
Materials Transactions
Sung K. Kang
Paul A. Lauro
Da-Yuan Shih
Donald W. Henderson
Jay Bartelo
Timothy A. Gosselin
Steve R. Cain
Charles Goldsmith
Karl J. Puttlitz
Tae K. Hwang
Won Kyoung Choi
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Citations (36)
The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
2004
Journal of Materials Research
Donald W. Henderson
James John Woods
Timothy A. Gosselin
Jay Bartelo
David E. King
T. M. Korhonen
M. A. Korhonen
Lawrence Lehman
Eric J. Cotts
Sung K. Kang
Paul A. Lauro
Da-Yuan Shih
Charles Goldsmith
Karl J. Puttlitz
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Citations (171)
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