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Pak Leung
Pak Leung
Freescale Semiconductor
Materials science
Engineering physics
Capacitor
Silicon on insulator
Chip
2
Papers
24
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The Effect of Material and Process Interactions on BEOL Integration
2009
Terry A. Spooner
John C. Arnold
D. Canaperi
James Chen
Shyng-Tsong Chen
Stephen M. Gates
Atsunobu Isobayashi
Pak Leung
Satyavolu S. Papa Rao
Muthumanickam Sankarapandian
Hosadurga Shobha
O. van der Straten
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Citations (7)
Application of on-chip MIM decoupling capacitor for 90nm SOI microprocessor
2005
IEDM | International Electron Devices Meeting
Douglas R. Roberts
W. Johnstone
Hector Sanchez
Om P. Mandhana
D. Spilo
Jim Hayden
Edward O. Travis
Brad Melnick
M. Celik
Byoung W. Min
John Edgerton
M. Raymond
E. Luckowski
C. Happ
A. Martinez
B. Wilson
Pak Leung
T. Garnett
D. Goedeke
T. Remmel
K. Ramakrishna
B.E. White
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Citations (17)
1