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Eric Bool
Eric Bool
Materials science
Electronic engineering
Composite material
Molding (process)
Integrated circuit packaging
2
Papers
26
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Unit warpage control with universal die thickness
2014
EPTC | Electronics Packaging Technology Conference
Gu Bin
Jun Dimaano
Richen Chen
Eric Bool
Seow Fui Shi
Choon Ghee Ang
Nathapong Suthiwongsunthorn
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Citations (6)
Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill
2005
ECTC | Electronic Components and Technology Conference
Xueren Zhang
Tong Yan Tee
Hun Shen Ng
Jerome Teysseyre
Shane Loo
Subodh Mhaisalkar
Fong Kuan Ng
Chwee Teck Lim
Xinyu Du
Eric Bool
Wenhui Zhu
Spencer Chew
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Citations (20)
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