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Fong Kuan Ng

National University of Singapore

Electronic engineering
Composite material
Materials science
Ball grid array
Thermal shock

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Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill

2005 ECTC | Electronic Components and Technology Conference
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Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

2004 EPTC | Electronics Packaging Technology Conference
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