author-photo

Shane Loo

Nanyang Technological University

5

Papers

42

Citations

Citation Trend

Filter By

Papers (5) Sort By

Journal Conference Others

Impact of Thermal, Moisture, and Mechanical Loading Conditions on Interfacial Fracture Toughness of Adhesively Bonded Joints

2007 Journal of Electronic Materials
Show All
- Source
- Cite
- Save
Citations (6)
Effect of surfactants on MWCNT-reinforced sol–gel silica dielectric composites

2007 Scripta Materialia
Show All
- Source
- Cite
- Save
Citations (14)
Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill

2005 ECTC | Electronic Components and Technology Conference
Show All
- Source
- Cite
- Save
Citations (20)
Effects of thermal, moisture and mechanical loading conditions on interfacial fracture toughness using Brazil-nut specimens

2005 EPTC | Electronics Packaging Technology Conference
Show All
- Source
- Cite
- Save
Citations (0)
Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

2004 EPTC | Electronics Packaging Technology Conference
Show All
- Source
- Cite
- Save
Citations (2)