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Choon Ghee Ang
Choon Ghee Ang
Materials science
Electronic engineering
Composite material
Molding (process)
Integrated circuit packaging
1
Papers
6
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Unit warpage control with universal die thickness
2014
EPTC | Electronics Packaging Technology Conference
Gu Bin
Jun Dimaano
Richen Chen
Eric Bool
Seow Fui Shi
Choon Ghee Ang
Nathapong Suthiwongsunthorn
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