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F. André
F. André
STMicroelectronics
Engineering
Electromigration
Optoelectronics
Physics
Image sensor
3
Papers
40
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Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
2018
IEDM | International Electron Devices Meeting
J. Jourdon
S. Lhostis
S. Moreau
J. Chossat
M. Arnoux
C. Sart
Y. Henrion
P. Lamontagne
L. Arnaud
N. Bresson
V. Balan
Catherine Euvrard
Y. Exbrayat
Daniel Scevola
E. Deloffre
S. Mermoz
A. Martin
H. Bilgen
F. André
C. Charles
D. Bouchu
A. Farcy
S. Guillaumet
A. Jouve
H. Fremont
S. Cheramy
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Citations (20)
In-line TEM sample preparation and wafer return strategy for rapid yield learning
2006
N. Bicaïs-Lépinay
F. André
S. Brevers
P. Guyader
C. Trouiller
L.F.Tz. Kwakman
S. Pokrant
D. Verkleij
R. Schampers
L. Ithier
E. Sicurani
C. Wyon
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Citations (3)
Lift-out techniques coupled with advanced TEM characterization methods for electrical failure analysis
2002
Microelectronics Reliability
N. Bicaı̈is-Lépinay
F. André
R. Pantel
S. Jullian
A. Margain
L.F.Tz. Kwakman
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Citations (17)
1