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H. Fremont
H. Fremont
University of Bordeaux
Electromigration
Chemical species
Passivation
Engineering
Copper
2
Papers
20
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0
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Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
2018
IEDM | International Electron Devices Meeting
J. Jourdon
S. Lhostis
S. Moreau
J. Chossat
M. Arnoux
C. Sart
Y. Henrion
P. Lamontagne
L. Arnaud
N. Bresson
V. Balan
Catherine Euvrard
Y. Exbrayat
Daniel Scevola
E. Deloffre
S. Mermoz
A. Martin
H. Bilgen
F. André
C. Charles
D. Bouchu
A. Farcy
S. Guillaumet
A. Jouve
H. Fremont
S. Cheramy
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Citations (20)
Effect of passivation annealing on the electromigration properties of hybrid bonding stack
2017
IRPS | International Reliability Physics Symposium
J. Jourdon
S. Moreau
David Bouchu
S. Lhostis
Nicolas Bresson
D. Guiheux
R. Beneyton
Sophie Renard
H. Fremont
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