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Influence of the Applied Load on the Creep Behaviour of Tin-Silver-Copper Solder
Influence of the Applied Load on the Creep Behaviour of Tin-Silver-Copper Solder
2019
Delfim Soares
Pedro E. Ribeiro
Pauline Capela
Daniel A. Barros
Maria F. Cerqueira
Senhorinha F. C. F. Teixeira
F. Macedo
José A. Teixeira
Keywords:
Soldering
Metallurgy
Tin-silver-copper
Creep
Materials science
Copper
Correction
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