Fabrication of optical MEMS switches having multilevel mirror-drive electrodes

The aim of this work is to show the effective way for the formation of optical MEMS switches by applying seamless integration technology (SeaiT) as a first step toward LSI integration. The fabrication process of the optical MEMS switches in this work consisted of electrode fabrication, mirror fabrication, and packaging. A 6-inch-diameter bulk-Si and SOI wafers are used for the fabrication of electrodes and mirrors, respectively.