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Fabrice Duval
Fabrice Duval
IMEC
Materials science
Flip chip
Wafer
Nanotechnology
Composite material
5
Papers
10
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Photosensitive polymer reliability for fine pitch RDL applications
2020
ECTC | Electronic Components and Technology Conference
Emmanuel Chery
Fabrice Duval
Michele Stucchi
John Slabbekoorn
Kristof Croes
Eric Beyne
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Citations (2)
Assembly Technology for Fine Pitch Bumps Using Photodefinable Wafer-Level Underfill
2017
Kazuyuki Mitsukura
Tomonori Minegishi
Keiichi Hatakeyama
Kenneth June Rebibis
Teng Wang
Fabrice Duval
Andy Miller
Eric Beyne
Kozo Fujimoto
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The Increasing Role of Polymers in Advanced Packaging - From Stress Buffer Layers to Wafer Level Underfills and Beyond
2017
Journal of Photopolymer Science and Technology
Andy Miller
Kenneth June Rebibis
Fabrice Duval
Teng Wang
John Slabbekoorn
Joeri De Vos
Eric Beyne
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Citations (5)
Packaging Material Evaluation for 2.5D/3D TSV Application
2016
Transactions of The Japan Institute of Electronics Packaging
Kazuyuki Mitsukura
Tatsuya Makino
Keiichi Hatakeyama
Kenneth June Rebibis
Teng Wang
Giovanni Capuz
Fabrice Duval
Mikael Detalle
Andy Miller
Eric Beyne
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Citations (2)
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