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Packaging Material Evaluation for 2.5D/3D TSV Application
Packaging Material Evaluation for 2.5D/3D TSV Application
2016
Kazuyuki Mitsukura
Tatsuya Makino
Keiichi Hatakeyama
Kenneth June Rebibis
Teng Wang
Giovanni Capuz
Fabrice Duval
Mikael Detalle
Andy Miller
Eric Beyne
Keywords:
Materials science
Manufacturing engineering
Electronic engineering
Interposer
Flip chip
Engineering physics
Metallurgy
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