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Assembly Technology for Fine Pitch Bumps Using Photodefinable Wafer-Level Underfill
Assembly Technology for Fine Pitch Bumps Using Photodefinable Wafer-Level Underfill
2017
Kazuyuki Mitsukura
Tomonori Minegishi
Keiichi Hatakeyama
Kenneth June Rebibis
Teng Wang
Fabrice Duval
Andy Miller
Eric Beyne
Kozo Fujimoto
Keywords:
Wafer
Flip chip
Composite material
Materials science
fine pitch
Optoelectronics
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