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John R. Pennacchia

IBM

6

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24

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High performance thin film single chip module

1998 ECTC | Electronic Components and Technology Conference
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A family of high performance MCM-C/D packages utilizing cofired alumina multilayer ceramic and a shielded thin film redistribution structure

1997
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Mcm-D Applications for a High Performance Module

1996
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Evaluation of Multi-Level Thin Film Structures A Case Study

1995
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Evaluation of Multi-Level Thin Film Structures A Case Study

1995
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