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Daniel G. Berger
Daniel G. Berger
IBM
Materials science
Composite material
Electronic engineering
Die (integrated circuit)
Chip
4
Papers
30
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An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
2015
ECTC | Electronic Components and Technology Conference
Katsuyuki Sakuma
Krishna Tunga
Buck Webb
Koushik Ramachandran
Marcus E. Interrante
Hsichang Liu
Matthew Angyal
Daniel G. Berger
John U. Knickerbocker
Subramanian S. Iyer
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Citations (21)
Bonding technologies for chip level and wafer level 3D integration
2014
ECTC | Electronic Components and Technology Conference
Katsuyuki Sakuma
Spyridon Skordas
Jeffrey A. Zitz
Eric D. Perfecto
William Leslie Guthrie
Luc Guerin
Richard Langlois
Hsichang Liu
Koushik Ramachandran
Wei Lin
Kevin R. Winstel
Sayuri Kohara
Kuniaki Sueoka
Matthew Angyal
Troy L. Graves-Abe
Daniel G. Berger
John U. Knickerbocker
Subramanian S. Iyer
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Citations (9)
Stressing the Need for Improved Pricing Metrics for Mcm-D and Mcm-D on C Products
1996
Daniel G. Berger
Howard M. Clearfield
William J. ODonnell
William R. Miller
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Evaluation of Multi-Level Thin Film Structures A Case Study
1995
Daniel G. Berger
John R. Pennacchia
Eric D. Perfecto
Hai Longworth
Ahmed Omar
Mary Cullinan-Scholl
Raj Patel
George White
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