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Buck Webb
Buck Webb
IBM
Composite material
Materials science
Soldering
Flip chip
Thermal copper pillar bump
2
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24
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Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections
2016
ECTC | Electronic Components and Technology Conference
Katsuyuki Sakuma
Buck Webb
Xiao Hu Liu
John U. Knickerbocker
Thomas Weiss
Shidong Li
Hongqing Zhang
Conor R. Thomas
Eric D. Perfecto
Tingge Xu
Hongbing Lu
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An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
2015
ECTC | Electronic Components and Technology Conference
Katsuyuki Sakuma
Krishna Tunga
Buck Webb
Koushik Ramachandran
Marcus E. Interrante
Hsichang Liu
Matthew Angyal
Daniel G. Berger
John U. Knickerbocker
Subramanian S. Iyer
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Citations (21)
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