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Hanzhong Mo
Hanzhong Mo
Soldering
Electronic engineering
Materials science
Miniaturization
Composite material
2
Papers
1
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Flexible connection for reflow free fine pitch SOP SMT components
2017
ICEPT | International Conference on Electronic Packaging Technology
Feiyang Liu
Xiaosong Ma
Bo Xu
Yongfa Cheng
Zhishen Liang
Baiqiang Chen
Shiwang Li
Hanzhong Mo
Zhengqi Zhong
Hua Wang
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Flexible connection for reflow free super fine pitch QFP SMT components
2017
ICEPT | International Conference on Electronic Packaging Technology
Yongfa Cheng
Xiaosong Ma
Bo Xu
Feiyang Liu
Zhishen Liang
Baiqiang Chen
Shiwang Li
Hanzhong Mo
Zhengqi Zhong
Hua Wang
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