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Yongfa Cheng
Yongfa Cheng
Guilin University of Electronic Technology
Materials science
Composite material
Soldering
Miniaturization
Ball grid array
5
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32
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Flexible IC Interconnection and Electrical Continuity Verification
2018
Xiaosong Ma
Bo Xu
Yuelin Chen
Yongfa Cheng
Feiyang Liu
Zhishen Liang
Baiqiang Chen
Shiwang Li
Hachong Mo
Zhengqi Zhong
Hua Wang
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Selective gas adsorption and I–V response of monolayer boron phosphide introduced by dopants: A first-principle study
2018
Applied Surface Science
Yongfa Cheng
Ruishen Meng
Chunjian Tan
Xianping Chen
Jing Xiao
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Modelling for electric devices: A hydrogen sulfide gas sensor based on born phosphide monolayer
2017
ICEPT | International Conference on Electronic Packaging Technology
Zhongkang Lin
Hao Shi
Ronggang Han
Liming Wang
Yongfa Cheng
Chunjian Tan
Huaiyu Ye
Xianping Chen
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Flexible connection for reflow free fine pitch SOP SMT components
2017
ICEPT | International Conference on Electronic Packaging Technology
Feiyang Liu
Xiaosong Ma
Bo Xu
Yongfa Cheng
Zhishen Liang
Baiqiang Chen
Shiwang Li
Hanzhong Mo
Zhengqi Zhong
Hua Wang
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Flexible connection for reflow free super fine pitch QFP SMT components
2017
ICEPT | International Conference on Electronic Packaging Technology
Yongfa Cheng
Xiaosong Ma
Bo Xu
Feiyang Liu
Zhishen Liang
Baiqiang Chen
Shiwang Li
Hanzhong Mo
Zhengqi Zhong
Hua Wang
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