Old Web
English
Sign In
Acemap
>
authorDetail
>
Feiyang Liu
Feiyang Liu
Guilin University of Electronic Technology
Soldering
Materials science
Miniaturization
Composite material
Ball grid array
3
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Flexible IC Interconnection and Electrical Continuity Verification
2018
Xiaosong Ma
Bo Xu
Yuelin Chen
Yongfa Cheng
Feiyang Liu
Zhishen Liang
Baiqiang Chen
Shiwang Li
Hachong Mo
Zhengqi Zhong
Hua Wang
Show All
Source
Cite
Save
Citations (1)
Flexible connection for reflow free fine pitch SOP SMT components
2017
ICEPT | International Conference on Electronic Packaging Technology
Feiyang Liu
Xiaosong Ma
Bo Xu
Yongfa Cheng
Zhishen Liang
Baiqiang Chen
Shiwang Li
Hanzhong Mo
Zhengqi Zhong
Hua Wang
Show All
Source
Cite
Save
Citations (1)
Flexible connection for reflow free super fine pitch QFP SMT components
2017
ICEPT | International Conference on Electronic Packaging Technology
Yongfa Cheng
Xiaosong Ma
Bo Xu
Feiyang Liu
Zhishen Liang
Baiqiang Chen
Shiwang Li
Hanzhong Mo
Zhengqi Zhong
Hua Wang
Show All
Source
Cite
Save
Citations (0)
1