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James Vickers
James Vickers
Los Angeles Mission College
Metrology
Engineering
Wafer
Electronic engineering
Design for manufacturability
2
Papers
4
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0
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Non-Contact, Pad-less Measurement Technology and Test Structures for Characterization of Cross-Wafer and In-Die Product Variability
2009
ICMTS | International Conference on Microelectronic Test Structures
Gary L. Steinbrueck
James Vickers
Majid Babazadeh
Mario M. Pelella
Nader Pakdaman
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Citations (3)
First Look at Across-chip Performance Variation Using Non-Contact, Performance-Based Metrology
2006
ASMC | Advanced Semiconductor Manufacturing Conference
Majid Babazadeh
Gloria Johnson
James Vickers
Jose J. Estabil
Nader Pakdaman
Gary L. Steinbrueck
Bertrand Borot
Wim Doedel
Jean Galvier
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