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Shingo Takahashi

Sony Broadcast & Professional Research Laboratories

7

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Reliability Improvement by Adopting Ti-barrier Metal B for Porous Low-k IL Structure

2006 IITC | International Interconnect Technology Conference
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Systeme et procede de polissage

2003
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Procede de polissage, dispositif de polissage, et procede de fabrication d'equipement a semi-conducteurs

2003
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New complementary PVD-Ta/CVD-WN stacked barrier structure for copper metallization

2002 IITC | International Interconnect Technology Conference
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Newly developed electro-chemical polishing process of copper as replacement of CMP suitable for damascene copper inlaid in fragile low-k dielectrics

2001 IEDM | International Electron Devices Meeting
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