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Zenya Yasuda
Zenya Yasuda
Sony Broadcast & Professional Research Laboratories
Metallurgy
Polishing
Copper
Copper interconnect
Corrosion
3
Papers
10
Citations
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New complementary PVD-Ta/CVD-WN stacked barrier structure for copper metallization
2002
IITC | International Interconnect Technology Conference
Kaori Tai
Hiizu Ohtorii
Shingo Takahashi
Naoki Komai
Hiroshi Horikoshi
Shuzo Sato
Y. Ohoka
Yuji Segawa
Masao Ishihara
Zenya Yasuda
Takeshi Nogami
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Citations (1)
Fragile porous low-k/copper integration by using electro-chemical polishing
2002
VLSIT | Symposium on VLSI Technology
Shingo Takahashi
Kaori Tai
Hiizu Ohtorii
Naoki Komai
Yuji Segawa
Hiroshi Horikoshi
Zenya Yasuda
H. Yamada
Masao Ishihara
Takeshi Nogami
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Citations (2)
Newly developed electro-chemical polishing process of copper as replacement of CMP suitable for damascene copper inlaid in fragile low-k dielectrics
2001
IEDM | International Electron Devices Meeting
Shuzo Sato
Zenya Yasuda
Masao Ishihara
Naoki Komai
Hiizu Ohtorii
Akira Yoshio
Y. Segawa
Hiroshi Horikoshi
Y. Ohoka
Kaori Tai
Shingo Takahashi
T Nogami
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Citations (7)
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