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Robert Lanzone
Robert Lanzone
Amkor Technology
Flip chip
Electronic engineering
Embedded system
Engineering
Interconnection
6
Papers
195
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Market Trends: Past, Present, and Future
2013
Robert Lanzone
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Next generation fine pitch Cu Pillar technology Enabling next generation silicon nodes
2011
Electronic Components and Technology Conference
Mark E. Gerber
Craig Beddingfield
Sean J. OConnor
Min Yoo
Minjae Lee
DaeByoung Kang
Sung-Su Park
Curtis Zwenger
Robert Darveaux
Robert Lanzone
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Citations (51)
Study of interconnection process for fine pitch flip chip
2009
ECTC | Electronic Components and Technology Conference
Minjae Lee
Min Yoo
Jihee Cho
Seungki Lee
Jaedong Kim
Choonheung Lee
DaeByoung Kang
Curtis Zwenger
Robert Lanzone
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Citations (52)
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