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Sung-Su Park
Sung-Su Park
Amkor Technology
Materials science
Pillar
Silicon
Electronic engineering
Soldering
3
Papers
142
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Next generation fine pitch Cu Pillar technology Enabling next generation silicon nodes
2011
Electronic Components and Technology Conference
Mark E. Gerber
Craig Beddingfield
Sean J. OConnor
Min Yoo
Minjae Lee
DaeByoung Kang
Sung-Su Park
Curtis Zwenger
Robert Darveaux
Robert Lanzone
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Citations (51)
Next generation fine pitch Cu Pillar technology — Enabling next generation silicon nodes
2011
ECTC | Electronic Components and Technology Conference
Mark A. Gerber
Craig Beddingfield
Shawn O'Connor
Min Yoo
Minjae Lee
DaeByoung Kang
Sung-Su Park
Curtis Zwenger
Robert Darveaux
Robert Lanzone
KyungRok Park
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Citations (84)
Board level reliability study on three-dimensional thin stacked package
2004
ECTC | Electronic Components and Technology Conference
Jin Young Kim
WonJoon Kang
Yoon-Hyun Ka
Yong-Joon Kim
Eun Sook Sohn
Sung-Su Park
Jae Dong Kim
Choonheung Lee
Akito Yoshida
Ahmer Syed
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Citations (7)
1