Old Web
English
Sign In
Acemap
>
authorDetail
>
Christof Landesberger
Christof Landesberger
Technical University of Berlin
Electronic packaging
Electronic engineering
Materials science
Chip
Engineering
5
Papers
21
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (5)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
A method for processing a semiconductor substrate
2004
Christof Landesberger
Andreas Ostmann
Show All
Source
Cite
Save
Citations (0)
Chip-in-polymer: volumetric packaging solution using PCB technology
2002
IEMT | International Electronics Manufacturing Technology Symposium
E. Jung
Dirk Wojakowski
A. Neumann
Christof Landesberger
Andreas Ostmann
Rolf Aschenbrenner
Herbert Reichl
Show All
Source
Cite
Save
Citations (7)
A new approach for system integrated packaging
2000
EPTC | Electronics Packaging Technology Conference
R. Aschenbrenner
A. Ostmann
E. Jung
Christof Landesberger
Herbert Reichl
Show All
Source
Cite
Save
Citations (0)
Concepts for ultra thin packaging technologies
2000
Aschenbrenner
Frank Ansorge
Michael Feil
Christof Landesberger
E. Jung
Andreas Ostmann
Herbert Reichl
Show All
Source
Cite
Save
Citations (4)
Thin Chip Integration (TCI-modules) : A novel technique for manufacturing three dimensional IC-packages
2000
M Topper
K. Scherpinski
H.-P. Sporle
Christof Landesberger
Oswin Ehrmann
Herbert Reichl
Show All
Source
Cite
Save
Citations (10)
1