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H.-P. Sporle
H.-P. Sporle
Thin film
Low-k dielectric
Chip
Dice
Electronic packaging
1
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Thin Chip Integration (TCI-modules) : A novel technique for manufacturing three dimensional IC-packages
2000
M Topper
K. Scherpinski
H.-P. Sporle
Christof Landesberger
Oswin Ehrmann
Herbert Reichl
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Citations (10)
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