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JungSoo Park

Amkor Technology

4

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Optimization of CMP process for TSV reveal in consideration of critical defect

2014 ECTC | Electronic Components and Technology Conference
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Optimization and challenges on TSV MEOL integration

2014 ECTC | Electronic Components and Technology Conference
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Characterization of Intermetallic Compound (IMC) growth in Cu wire ball bonding on Al pad metallization

2011 Electronic Components and Technology Conference
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Characterization of intermetallic compound (IMC) growth in Cu wire ball bonding on Al pad metallization

2011 ECTC | Electronic Components and Technology Conference
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