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DoHyeong Kim

Amkor Technology

3

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TSV integration on 20nm logic Si: 3D assembly and reliability results

2014 ECTC | Electronic Components and Technology Conference
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Optimization of CMP process for TSV reveal in consideration of critical defect

2014 ECTC | Electronic Components and Technology Conference
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Optimization and challenges on TSV MEOL integration

2014 ECTC | Electronic Components and Technology Conference
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