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SeungChul Han
SeungChul Han
Amkor Technology
Electronic engineering
Materials science
Dry etching
Wafer dicing
Wafer testing
2
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4
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0
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Optimization of CMP process for TSV reveal in consideration of critical defect
2014
ECTC | Electronic Components and Technology Conference
Donghoon Lee
DoHyeong Kim
SeungChul Han
JooHyun Kim
JungSoo Park
BoRa Jang
YoungSuk Chung
SeongMin Seo
Yong-Sang Kim
Choonheung Lee
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Optimization and challenges on TSV MEOL integration
2014
ECTC | Electronic Components and Technology Conference
DoHyeong Kim
DongHun Lee
YoungChul Seo
JungSoo Park
SeungChul Han
BoRa Jang
JooHyun Kim
YoungSuk Chung
SeongMin Seo
Choonheung Lee
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Citations (4)
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