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Toshihiko Ochiai
Toshihiko Ochiai
Renesas Electronics
Electronic engineering
Through-silicon via
Flip chip
Materials science
Dram
5
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19
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TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking
2014
ECTC | Electronic Components and Technology Conference
Duk Ju Na
Kyaw Oo Aung
Won Kyung Choi
Tsuyoshi Kida
Toshihiko Ochiai
Tomoaki Hashimoto
Michitaka Kimura
Keiichirou Kata
Seung Wook Yoon
Andy Yong
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Challenges of design and packaging for 3D stacking with logic and DRAM dies
2014
ICEP | International Conference on Electronics Packaging
Kazuki Fukuoka
Koji Nii
Takao Nomura
Ryo Mori
Toshihiko Ochiai
Koji Takayanagi
Kentaro Mori
Tsuyoshi Kida
Sadayuki Morita
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Citations (3)
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