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Duk Ju Na
Duk Ju Na
STATS ChipPAC Ltd
Electronic engineering
Through-silicon via
Materials science
Wafer
Wafer-level packaging
4
Papers
17
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Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
2015
Won Kyoung Choi
Duk Ju Na
Kyaw Oo Aung
Andy Yong
Jae Sik Lee
Urmi Ray
Riko Radojcic
Bernard Adams
Seung Wook Yoon
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Citations (3)
Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages
2015
Won Kyoung Choi
Duk Ju Na
Kyaw Oo Aung
Andy Yong
Jaesik Lee
Urmi Ray
Riko Radojcic
Bernard Adams
Seung Wook Yoon
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Citations (1)
TSV MEOL (Mid End of Line) and packaging technology of mobile 3D-IC stacking
2014
ECTC | Electronic Components and Technology Conference
Duk Ju Na
Kyaw Oo Aung
Won Kyung Choi
Tsuyoshi Kida
Toshihiko Ochiai
Tomoaki Hashimoto
Michitaka Kimura
Keiichirou Kata
Seung Wook Yoon
Andy Yong
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2.5D/3D TSV processes development and assembly/packaging technology
2011
EPTC | Electronics Packaging Technology Conference
Seung Wook Yoon
Duk Ju Na
Won Kyoung Choi
Keon Taek Kang
Chang Bum Yong
YoungChul Kim
Pandi C. Marimuthu
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Citations (5)
1