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Hsin-Chia Fu
Hsin-Chia Fu
Industrial Technology Research Institute
Electronic engineering
Three-dimensional integrated circuit
Materials science
Wire bonding
Copper
2
Papers
12
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0
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Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies
2012
DIC | IEEE International D Systems Integration Conference
Cheng-Ta Ko
Zhi-Cheng Hsiao
Y. J. Chang
Peng-Shu Chen
Jui-Hsiung Huang
Hsin-Chia Fu
Yu-Jiau Huang
Chia-Wen Chiang
W. L. Tsat
Yu-Hua Chen
Wei-Chung Lo
Kuan-Neng Chen
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Citations (11)
Cu-based bonding technology for 3D integration applications
2012
DIC | IEEE International D Systems Integration Conference
Kuan-Neng Chen
Zheng Xu
F. Liu
Cheng-Ta Ko
Chuan-An Cheng
Wen-Chun Huang
H. L. Lin
C. Cabral
Zhi-Cheng Hsiao
N. Klymko
Hsin-Chia Fu
Yu-Hua Chen
Jian-Qiang Lu
Wei-Chung Lo
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Citations (1)
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