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C. Cabral
C. Cabral
IBM
Electronic engineering
Materials science
Electronic circuit
Inductance
Niobium
5
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80
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0.01
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Cu-based bonding technology for 3D integration applications
2012
DIC | IEEE International D Systems Integration Conference
Kuan-Neng Chen
Zheng Xu
F. Liu
Cheng-Ta Ko
Chuan-An Cheng
Wen-Chun Huang
H. L. Lin
C. Cabral
Zhi-Cheng Hsiao
N. Klymko
Hsin-Chia Fu
Yu-Hua Chen
Jian-Qiang Lu
Wei-Chung Lo
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Interconnect processes and reliability for RF technology
2011
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
J. Gambino
Felix P. Anderson
Edward C. Cooney
J. He
Ronald J. Bolam
Bucknell C. Webb
C. Cabral
Thomas M. Shaw
Daniel S. Vanslette
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Citations (2)
Effect of a surface layer on the stress relaxation of thin films
1996
Journal of Vacuum Science and Technology
M. D. Thouless
Kenneth P. Rodbell
C. Cabral
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Citations (55)
Octagonal washer DC SQUIDs and integrated susceptometers fabricated in a planarized sub- mu m Nb-AlO/sub x/-Nb technology
1993
IEEE Transactions on Applied Superconductivity
Mark B. Ketchen
Dale Jonathan Pearson
Kevin Stawiasz
C.-K. Hu
A. W. Kleinsasser
T. Brunner
C. Cabral
V. Chandrashekhar
Mark Anthony Jaso
M. Manny
K.J. Stein
Manjul Bhushan
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Citations (20)
Nb-AlO x -Nb SNAP Technology for 125 mm Wafers Developed in Partnership with Silicon Technology
1992
M. Bhushan
Mark B. Ketchen
C.-K. Hu
Kevin Stawiasz
C. Cabral
M. Smyth
E. Baran
Dale Jonathan Pearson
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Citations (2)
1